@joegrand tweeted, “Practicing BGA reballing with the @dangerousproto BGA Reballing Practice Kit.” More resources and instructions available here. Get your own kit for $79 at Seeed.
Space saving BGA packages application note (PDF) from Fairchild Semiconductors. Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right interface and logic products with new package technology can have a significant impact on the capabilities and form-factor of the end product. […]
At Hacker Camp Shenzhen we learned to reball BGA chips at a mobile phone repair school. This technique was developed to repair cell phones with little to no equipment. That means no expensive reballing rigs, no collection of tiny replacement BGA balls. Just simple hand tools. We thought it was so cool we bought all […]
Chris shared his experience dead-bugging BGA sized chips on our Who says BGA packages are hard to solder post. Here is my attempt at dead-bugging a finer pitch BGA, though thankfully with fewer pins. It works, but I wouldn’t trust it to keep working in a rough environment Via the comments.
Here is proof that soldering BGA’s is not that hard. Check out this Mandelbrot zoom fractal engine with a PSP display project (machine translation). The FPGA in a ball grid array package is soldered dead bug style. Now that’s skill. Via the forum, and Hack a Day.
Here is Texas Instrument’s application note on Ball Grid Array IC packages. It provides general information about BGAs, and the many versions of the same. Leaders in the consumer electronics industry will be determined by their ability to deliver increasingly miniaturized products at lower costs. The Ball Grid Array (BGA) package achieves these objectives by […]
Andrew decided to write up a how-to on DIY BGA soldering. His article describes why it’s a bad idea to keep the vias unfilled with solder before reflow. Capilary force sucks up the ball of solder into the via, and there is no solder left to make contact between the IC and the pad. After […]
In an earlier Workshop Video we challenged Sjaak to solder a TMP006 non-contact temperature sensor in a BGA package. We lacked the skills to make it happen, but this week DP engineer Jer shows how he successfully soldered 2 of 4 breakout boards. Jer doesn’t hold the the chip in place with kapton tape like […]
Ball Grid Array chips have multiple rows of contacts under the chip. These are difficult to solder by hand, as we found out when Sjaak tried to solder a TMP006. Zeta tipped us to this video of hand soldering a 400 pin BGA chip to a SchmartBoard breakout. The breakout board has a via under […]
We took our cameras on the road and visited Sjaak’s workshop this week. He showed us how he solders QFN chips with a bit of hot air and normal drag-soldering. We also surprised him with a challenge to solder a tiny BGA chip, see how it turns out. Here’s some links mentioned in the video: […]
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Jack at the Gadget Factory (co-creator of the Logic Sniffer) documented his pancake griddle BGA circuit board soldering technique. Via Hack a Day.