Space saving BGA packages application note (PDF) from Fairchild Semiconductors.
Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right interface and logic products with new package technology can have a significant impact on the capabilities and form-factor of the end product. Leaded surface mount devices are constantly pushing the manufacturing capabilities of leading board manufacturers to finer and finer lead pitch geometry’s to increase I/O density and reduce board space.