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Posts Tagged ‘Practice Kit’

NEW PROJECT: BGA Reballing Practice Kit, removal, reballing, soldering exercise

Thursday, May 1st, 2014

At Hacker Camp Shenzhen we learned to reball BGA chips at a mobile phone repair school. This technique was developed to repair cell phones with little to no equipment. That means no expensive reballing rigs, no collection of tiny replacement BGA balls. Just simple hand tools. We thought it was...

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Posted in Chips, components, Hacker Camp Shenzhen, Prototypes | 6 Comments »

Recent Comments

  • gant: They still have a couple of the more expensive (but still considerably cheap) 5S-I-S01 in stock...
  • readybrek: Anyone got a any recommendations for a budget-priced hot air station?
  • William: lol I'm happy to waste 3c for each program/debug cycle... but probably not the time spent soldering a new device down to a proto board!...
  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!