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Workshop Video #10: BGA revisited

Thursday, March 1st, 2012

[embed]http://www.youtube.com/watch?v=_5c_qkjx2nQ[/embed] In an earlier Workshop Video we challenged Sjaak to solder a TMP006 non-contact temperature sensor in a BGA package. We lacked the skills to make it happen, but this week DP engineer Jer shows how he successfully soldered 2 of 4 breakout boards. Jer doesn't hold the the chip...

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Posted in skills, Videos | 19 Comments »

Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please