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NEW PROJECT: BGA Reballing Practice Kit, removal, reballing, soldering exercise

Posted on Thursday, May 1st, 2014 in Chips, components, Hacker Camp Shenzhen, Prototypes by DP

BGA Reballing Kit

At Hacker Camp Shenzhen we learned to reball BGA chips at a mobile phone repair school. This technique was developed to repair cell phones with little to no equipment. That means no expensive reballing rigs, no collection of tiny replacement BGA balls. Just simple hand tools.

We thought it was so cool we bought all the exact same equipment used at the school and put it into a kit. In a few weeks we’ll post the video from the soldering workshop (don’t miss day 2’s lectures today). If you order the BGA kit now you can have it in time to follow along with the BGA rework video! How cool is that?

A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes.

What’s in the box:

  1. Recycled mobile phone (chip donor)
  2. Solder paste
  3. Flux
  4. Spatula
  5. Tweezers right angle (ST-15)
  6. Tweezers sharp (ST-11)
  7. Knife and flat blade
  8. BGA stencil
  9. PCB holder
  10. Screw driver
  11. Phone opening tools
  12. Cotton sticks
  13. Dangerous Prototypes stickers

You will need to bring your own (B.Y.O.):

  1. Soldering iron (any will work)
  2. Hot air rework station
  3. Acetone (or nail polish remover)
  4. Tissues

More resources and instructions available here.

Get your own kit for $79 at Seeed. Remember this includes the EXACT tools used at the hacker camp so it will be easy to follow the tutorial videos we post in a few weeks. If you couldn’t make the camp, here’s your chance to follow along at home!

This entry was posted on Thursday, May 1st, 2014 at 3:00 pm and is filed under Chips, components, Hacker Camp Shenzhen, Prototypes. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

6 Responses to “NEW PROJECT: BGA Reballing Practice Kit, removal, reballing, soldering exercise”

  1. countFunkula says:

    My kit arrived today! Everything looks great! Plus, the donor phone is so beat, worn, and generally gnarly, I won’t even REMOTELY feel bad about using it for practice!

    …Now how about posting that video!?

    • Ian says:

      Next week will be Day 3 discussions. We’ll try to have soldering workshop the following week but it’s also Maker Faire so it might slip to the week following.

  2. Steve says:

    How important is the BGA stencil to the process? I have a variation on all the tools you have listed except for the stencil.

    Maybe you could sell the stencil separately?

    • GotNoTime says:

      You need the stencil to apply the solder paste in the correct locations and amounts.

    • ian says:

      The stencil is the key part of the process. Unfortunately we couldn’t find a generic stencil either, the stencil has to match the chip you’re using. That’s the value in the kit, we hunted down a phone and stencil that match :)

    • David says:

      I would suggest that you remove a BGA chip from somewhere, and then you will be able to see the pinout , if you cannot find it from the datasheet of the chip you’re going to remove. Once the chip is removed , you can buy a stencil fit for that particular pin layout, a kit that will provide a few common stencils, or you can even make your own stencils.

      An example of self made stencil :

      http://hackaday.com/2013/07/02/the-definitive-guide-to-solder-stencils/

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