App note: Board level application notes for DFN and QFN packages

Board mounting an DFN/QFN (Dual/Quad Flat-Pack No lead) application note from ON Semiconductor. Link here (PDF) The DFN/QFN platform offers a versatility which allows either a single or multiple semiconductor devices to be connected together within a leadless package. These guidelines include printed circuit board mounting pads, solder mask and stencil pattern and assembly process […]

App note: PCB Design Guidelines for QFN and DQFN Packages

Efficiently design your PCB involving QFN or DQFN packages with this App note from Microchip. Successful implementation of QFN and DQFN packages requires special consideration for printed circuit board (PCB) layout and solderpaste stencil production. This application note describes the important items to consider. QFN packages are physically robust, thermally efficient, and occupy much less […]

Workshop video #01: Sjaak solders a QFN chip, attempts the BGA challenge

We took our cameras on the road and visited Sjaak’s workshop this week. He showed us how he solders QFN chips with a bit of hot air and normal drag-soldering. We also surprised him with a challenge to solder a tiny BGA chip, see how it turns out. Here’s some links mentioned in the video: […]