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Dead-bugging a fine pitch BGA chip

Posted on Thursday, November 8th, 2012 in DIY by DP

Chris shared his experience dead-bugging BGA sized chips on our Who says BGA packages are hard to solder post.

Here is my attempt at dead-bugging a finer pitch BGA, though thankfully with fewer pins. It works, but I wouldn’t trust it to keep working in a rough environment

Via the comments.

This entry was posted on Thursday, November 8th, 2012 at 7:00 pm and is filed under DIY. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

7 Responses to “Dead-bugging a fine pitch BGA chip”

  1. f4eru says:

    Did that with a 0.5mm pitch uBGA (50 pins).
    I call it “bonding” :)
    pour epoxy, and it should last forever.

  2. ewertz says:

    I just threw-up in my own mouth. That’s some sick work! :-)

  3. f4eru de f4grx: would have suggested the same thing, epoxy is the way to go to make that last

    nice job!

  4. Winston says:

    Another impressive electronics surgeon. Amazingly steady hands.

  5. Xevel says:

    Far from being as impressive as the two previously posted, still here is my take on fine pitch BGA dead-bug soldering ;) (with video!)

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