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Posts Tagged ‘NXP’

App note: NXP Smartphone Quick-Jack Solution

Sunday, June 22nd, 2014

An interesting app note (PDF) from NXP where you can interface your mobile phone with a microcontroller via the audio 3.5mm jack. Inspired by the University of Michigan's Project HiJack, the NXP Smartphone Quick-Jack Solution repurposes the standard 3.5mm stereo audio jack found on most smartphones into a self-powered data...

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Posted in app notes | 2 Comments »

App note: Sending I2C-bus signals via long communications cables

Sunday, June 22nd, 2014

Extend I2C communication distance with this app note (PDF) from NXP. Reliable I2C-bus communication at high data rates, and over many meters, can be achieved using widely available twisted- pair communication cable (e.g. Category 5e and similar 4-pair cables, as typically used for Ethernet communications). The two bidirectional I2C-bus signals,...

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App note: Cascading NXP LCD segment drivers

Sunday, March 2nd, 2014

A great app note from NXP on cascading multiple LCD driver to work as one large display. This application note aims to assist designers using NXP LCD segment drivers in making a cascaded design. Cascading means combining more than one LCD driver in a design in such a way that...

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App note: Guidelines for full-speed USB on NXP’s LPC microcontrollers

Sunday, March 2nd, 2014

Hook up your LPC microcontrollers using USB full-speed connectivity using these guidelines from NXP app note Full-speed USB operates at 12 Mb/s, and although this is not a high data rate, observing some basic rules or guidelines will usually guarantee successful operation. This application note highlights some of the more...

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App note: microcontrollers and triacs easily connected

Sunday, February 9th, 2014

Here's an application note from NXP on how to easily connect main triacs and microcontrollers. This application note describes the easy connection of NXP LPC microcontrollers and three - quadrant (Hi-Com) triacs to control any resistive or inductive load at mains voltage. A one-for-all control method is presented that uses...

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Posted in app notes | 2 Comments »

Which Switch is Which?

Saturday, January 18th, 2014

Another great video tutorial on analog switches from LogicHead What is an Analog Switch? Learn how they work and the many different types available to solve all your switching needs

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How do I read a datasheet?

Saturday, January 18th, 2014

Great introduction from LogicHead on what's inside a datasheet Take a guided tour through a Logic datasheet, and learn where to find the answers to the most commonly asked Logic questions

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App note: Interfacing 3V and 5V applications

Saturday, January 11th, 2014

Another app note from NXP/Phillips Semiconductor on I/O voltage level shifting. Many reasons exist to introduce 3V systems, notably the lower power consumption for mobile applications and the introduction of parts that use technologies with such fine geometries that 5V is simply not allowed any more. The introduction of the...

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Posted in app notes | 2 Comments »

App note: properties and application of bypass capacitors

Sunday, December 15th, 2013

Another primer app note from NXP on capacitor bypassing. Bypass capacitors are applied between the power supply pins VCC and GND of integrated circuits. They reduce both the power supply noise and the effect of spikes on the supply line. They also provide instantaneous current demands of the integrated circuit...

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LPC812 Breakout board

Tuesday, November 19th, 2013

cpldcpu writes: I grew fond of NXPs new LPC800 Cortex M0+ microcontrollers. I designed a small breakout for the LPC812 TSSOP20. This is the second revision. It includes push buttons for reset and activating the serial bootloader. The board has an integrated 500mA 3.3V LDO to supply both the MCU...

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Posted in project logs | 6 Comments »

Diamond package from NXP, the world’s smallest logic package

Thursday, July 4th, 2013

Drone refers us to this short video from NXP on very small pitch parts (0.35mm) and the challenges in mounting them. NXP debuts their new Diamond package which they report is over 25 percent smaller than their XSON package (suffix GN), previously the world's smallest package. The video point out...

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Posted in components, News, Videos | 5 Comments »

NXP announces LPC800-MAX dev board

Wednesday, February 27th, 2013

NXP has announced the LPC800-MAX – an mbed/Arduino development board based on the LPC812 – which will be released in April 2013. NXP is working with key partners to develop LPC800-MAX, a development board which combines mbed, LPCXpresso and Arduino connectivity, allowing users to choose and work with their favorite...

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Posted in Arduino, dev boards, News | 6 Comments »

Surface mount package cheat sheets

Thursday, September 20th, 2012

NXP released these posters with images of all the SMD packages they use. It could be an easy way for you to quickly see how an unfamiliar package looks. Clicking on the package in the PDF document to bring up a page with mechanical design files. There are two posters...

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Posted in Chips | 9 Comments »

NXP RF component manual

Tuesday, July 10th, 2012

NXP has released the 16th edition of their RF component manual. It covers the full line of NXP RF offerings including their core technologies QUBiC4 and LDMOS, GPS LNAs, medium power amplifiers, IF gain blocks, satellite LNB ICs and CATV modules, amplifiers (low noise, variable gain, medium power and high...

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Posted in components, documentation, RF | No Comments »

App note: Full-duplex software UART for LPC111x and LPC13xx

Sunday, July 1st, 2012

Here is an app note with source code describing how to implement a full-duplex software UART interface on LPC111x and LPC13xx microcontrollers. However, some applications require more UARTs than are available on the device. While the addition of an external stand-alone UART IC could be used in some of these...

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App note: PCB layout for analog to digital converters

Sunday, May 13th, 2012

NXP provides some PCB layout design guidelines for the ADC modules in their LPC1100 and LPC1300 microcontrollers. These ADC modules, like many microcontrollers, use the power supply voltage as a reference so special care has to be taken to eliminate noise: The microcontrollers in the LPC1100 and LPC1300 families are...

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NXP Cortex-MO marketing fail

Sunday, April 10th, 2011

A few weeks ago NXP sent us a survey and offered a free LPCXpresso board for completing it. We filled out the survey and expected a dev-board or breakout board, and a CD with datasheets, compilers, etc. Something like the STM8/32, MSP430 LaunchPad, and other simple boards other manufacturers have...

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Posted in ARM | 37 Comments »

mbed design challenge

Tuesday, February 1st, 2011

The mbed is a tool for rapid prototyping with the NXP LPC1768 ARM MCU. This MCU is an ARM Cortex-M3 Core running at 96MHz, 512KB FLASH, 64KB RAM and includes Ethernet, USB (Device and Host), CAN, SPI, I2C and other I/O. The mbed's design includes 0.1" DIP breadboard compatible pins...

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Posted in News | 4 Comments »

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Recent Comments

  • readybrek: Anyone got a any recommendations for a budget-priced hot air station?
  • William: lol I'm happy to waste 3c for each program/debug cycle... but probably not the time spent soldering a new device down to a proto board!...
  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...