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An open letter to NXP Semiconductors about LPC1114FN28

Friday, July 25th, 2014

ytsuboi  wrote an open letter to CEO of NXP, and get replied: I sent this e-mail to the CEO of NXP Semiconductors. (23 July 2014, 4:36am JST) To: NXP Semiconductors N.V‎ Richard L. Clemmer, Executive Director, President and CEO Dear Mr. Clemmer, About a week ago, I found an unbelievable information about...

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Posted in ARM | 3 Comments »

Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please