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App note: Thermal behavior of small-signal discretes on multilayer PCBs

Posted on Sunday, January 31st, 2016 in app notes by DP

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App note from NXP Semiconductors about multilayer PCB as additional heatsink for flat SMD components mostly power transistors to dissipate heat. Link here (PDF)

This application note illustrates how to improve the power dissipation of discrete components by using multilayer PCBs. It focuses on the impact of using larger copper areas to improve the thermal behavior of applications.

This entry was posted on Sunday, January 31st, 2016 at 5:00 pm and is filed under app notes. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

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