Posts Tagged ‘PCB design guidelines’

App note: Board level application notes for DFN and QFN packages

Sunday, June 16th, 2019

Board mounting an DFN/QFN (Dual/Quad Flat-Pack No lead) application note from ON Semiconductor. Link here (PDF) The DFN/QFN platform offers a versatility which allows either a single or multiple semiconductor devices to be connected together within a leadless package. These guidelines include printed circuit board mounting pads, solder mask and...

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App note: General layout guidelines for RF and mixed-signal PCBs

Sunday, January 29th, 2012

Rsdio came across an interesting app note from Maxim and shared it with us. These are some PCB layout guidelines for RF and mixed-signal designs. This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some discussion of mixed-signal applications, such as digital, analog,...

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Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please