App note: Board level application notes for DFN and QFN packages

Board mounting an DFN/QFN (Dual/Quad Flat-Pack No lead) application note from ON Semiconductor. Link here (PDF) The DFN/QFN platform offers a versatility which allows either a single or multiple semiconductor devices to be connected together within a leadless package. These guidelines include printed circuit board mounting pads, solder mask and stencil pattern and assembly process […]

App note: General layout guidelines for RF and mixed-signal PCBs

Rsdio came across an interesting app note from Maxim and shared it with us. These are some PCB layout guidelines for RF and mixed-signal designs. This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some discussion of mixed-signal applications, such as digital, analog, and RF components on the […]