App note: Board level application notes for DFN and QFN packages

an_on_AND8211-D

Board mounting an DFN/QFN (Dual/Quad Flat-Pack No lead) application note from ON Semiconductor. Link here (PDF)

The DFN/QFN platform offers a versatility which allows either a single or multiple semiconductor devices to be connected together within a leadless package. These guidelines include printed circuit board mounting pads, solder mask and stencil pattern and assembly process parameters.

Leave a comment

Your email address will not be published. Required fields are marked *

Notify me of followup comments via e-mail. You can also subscribe without commenting.