At Hacker Camp Shenzhen we learned to reball BGA chips at a mobile phone repair school. This technique was developed to repair cell phones with little to no equipment. That means no expensive reballing rigs, no collection of tiny replacement BGA balls. Just simple hand tools.
We thought it was so cool we bought all the exact same equipment used at the school and put it into a kit. In a few weeks we’ll post the video from the soldering workshop (don’t miss day 2’s lectures today). If you order the BGA kit now you can have it in time to follow along with the BGA rework video! How cool is that?
A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes.
What’s in the box:
- Recycled mobile phone (chip donor)
- Solder paste
- Tweezers right angle (ST-15)
- Tweezers sharp (ST-11)
- Knife and flat blade
- BGA stencil
- PCB holder
- Screw driver
- Phone opening tools
- Cotton sticks
- Dangerous Prototypes stickers
You will need to bring your own (B.Y.O.):
- Soldering iron (any will work)
- Hot air rework station
- Acetone (or nail polish remover)
More resources and instructions available here.
Get your own kit for $79 at Seeed. Remember this includes the EXACT tools used at the hacker camp so it will be easy to follow the tutorial videos we post in a few weeks. If you couldn’t make the camp, here’s your chance to follow along at home!