TQFN footprint pad via design guide for proper thermals from Diodes Incorporated. Link here (PDF) TQFN packages have exposed pads to provide excellent electrical grounding paths to the PCB and transfer the device heat through thermal vias on the PCB thermal landing to the internal copper planes. In order to maximize the removal of heat […]
Tag Archives: footprint
App note: Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages
NXP’s app note about the internals and how to’s footprint design and solder their leadless dual and quad flat packages. Link here (PDF) The small outline no-lead (SON)/quad flat no-lead (QFN) is a small size, lead-less plastic package with a low profile, moderate thermal dissipation, and good electrical performance. It is a surface mount package […]
Hacking footprints for easier 2 layer routing
Routing complex surface mount circuits on a 1 or 2 layer PCB is tricky. TSSOP and similar small parts often don’t have enough clearance to route a trace between two leads. Mats tackled this by by removing a few unused leads. This gave him the freedom to route traces through the now available space where […]
Designing Eagle footprints from mechanical drawings
Adafruit shows how to accurately design footprints in Eagle. The process imports the mechanical drawing into Eagle, and the footprint is traced over this template. It’s best used for mechanical parts – connectors, buttons, jacks, etc – that have complicated footprint designs. You can also check out our guide to building simple footprints in Eagle, […]