App note: Pulsed Over-Current Driving of LEDs

App note from CREE on driving LEDs over its specified current capability. Link here (PDF) The Applications Engineering team at Cree is often asked whether it is safe to operate Cree XLamp® LEDs with pulsed currents above the maximum data-sheet rating. This question is usually asked in the context of legitimate product requirements such as […]

App note: Optimizing PCB Thermal Performance for LEDs

Application note from CREE on efficiently designing a conventional FR4 PCB to manage thermal heat and as a cheap alternative to metal core pcbs. Link here (PDF) One of the most critical design parameters for an LED illumination system is the system’s ability to draw heat away from the LED junction. High operating temperatures at […]

App note: Avoidance of ceramic-substrate-based LED chip cracking induced by PCB bending or flexing

Application note from CREE on the causes of ceramic-substrate-based failures due to PCB board stresses and how to minimize their occurrence. Link here (PDF) Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the […]