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App note: Avoidance of ceramic-substrate-based LED chip cracking induced by PCB bending or flexing

Posted on Sunday, May 13th, 2018 in app notes by DP

an_cree_LED_chip_cracking

Application note from CREE on the causes of ceramic-substrate-based failures due to PCB board stresses and how to minimize their occurrence. Link here (PDF)

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a precondition to more rigorous environmental tests such as thermal cycling or thermal shock.

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