Hacker Camp Shenzhen volume 2: “Reflux” is on! Join us from Thursday September 25 to Saturday September 27, 2014 for fun, food and solder fumes in Shenzhen, China. Tickets are available now. Come to the world’s electronics capital and experience Shenzhen like a local hacker. Tour the famous Huaqiangbei electronics markets with people who live […]
Tag Archives: BGA reballing
App Note: Reballing BGA devices tutorial
Here’s a video tutorial on how to reball BGA devices. First you’ll need to remove the IC, and clean up the leftover solder from the IC and the board. Next step is to place the ball grid template over the IC and add tiny solder pellets which when heated will adhere to the IC. Once […]