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Posts Tagged ‘BGA reballing’

Hacker Camp Shenzhen vol 2: Reflux open for registration

Thursday, August 7th, 2014

Hacker Camp Shenzhen volume 2: "Reflux" is on! Join us from Thursday September 25 to Saturday September 27, 2014 for fun, food and solder fumes in Shenzhen, China. Tickets are available now. Come to the world's electronics capital and experience Shenzhen like a local hacker. Tour the famous Huaqiangbei electronics...

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Posted in Global Geek, Hacker Camp Shenzhen, Shenzhen | 10 Comments »

App Note: Reballing BGA devices tutorial

Saturday, January 26th, 2013

[embed]http://www.youtube.com/watch?v=f3N3PEIYPXk&feature=em-subs_digest-vrecs[/embed[ Here's a video tutorial on how to reball BGA devices. First you'll need to remove the IC, and clean up the leftover solder from the IC and the board. Next step is to place the ball grid template over the IC and add tiny solder pellets which when heated...

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Posted in app notes | 4 Comments »

Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please