App Note: Reballing BGA devices tutorial

Here’s a video tutorial on how to reball BGA devices. First you’ll need to remove the IC, and clean up the leftover solder from the IC and the board. Next step is to place the ball grid template over the IC and add tiny solder pellets which when heated will adhere to the IC. Once this is complete you can place the BGA back on the board and solder it again.

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4 Comments

  1. Upto removing the solder, I can see myself doing. But everything after that, the balls, IR melting the balls IN PLACE! … nah, not in this lifetime :)

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