We’ve finalized our xQFP footprints. The pads in the old design were short, making soldering hard. The new design remedies that, and comes with our standard CC BY-SA license. The files are available in our Eagle library.
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We’ve finalized our xQFP footprints. The pads in the old design were short, making soldering hard. The new design remedies that, and comes with our standard CC BY-SA license. The files are available in our Eagle library.
How about combining the two footprints on opposite sides of the same PCB? Similar concept like this SOIC/TSSOP breakout board: http://store.oshpark.com/products/28-pin-soic-tssop-to-dip
Having different pitches on the back- and frontside of the pcb sounds like a good idea. It’s almost like two-for-the-price-of-one….
good idea guys
having unconnected lines in the middle of signal traces will probably have bad effects with high-speed signals.
they will act as quarter wave opened line stubs, e.g. resonant bandpass filters.
maybe that’s acceptable for a breakout board, because the signal frequency will never be so high… but whatever.
You can always cut the traces on the unused side of the board to remove the stubs.