Workshop Update for April 9th, 2013

Posted on Tuesday, April 9th, 2013 in Workshop Update by DP


We started using a professional sourcer for our kits. Will have a full report when we get results.

Another batch of SMD breakout boards is designed. The one pictured above is of a 0.5mm and 0.65mm pitch 80pin QFP package. The two different pitched footprints are on opposite sides of the board.

This entry was posted on Tuesday, April 9th, 2013 at 11:30 pm and is filed under Workshop Update. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

6 Responses to “Workshop Update for April 9th, 2013”

  1. Alan says:

    Unlike the XQFP breakout board, this looks fairly “breadboard friendly”
    Looking at small FPGAs there’s the Lattice ICE40 LP384, in 32-pin QFN or 36-point BGA. Any chance of a compatible breakout board? I suspect the BGA would need both sides…

  2. vimark says:

    Be aware that this board is huge and more likely consume the whole breadboard

  3. Jim Narem says:

    Note the discussion in over two years ago. Going vertical is the right direction for QFP adapters on breadboards. These horizontal ones cover up too many holes.

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