App note from TDK on design considerations of preamps used on MEMS microphones. Link here A microphone preamp circuit is used to amplify a microphone’s output signal to match the input level of the devices following it in the signal chain. Matching the peaks of the microphone’s signal level to the full-scale input voltage of […]
Tag Archives: TDK
App note: Analog and digital MEMS microphone design considerations
App note from TDK about the things to consider when integrating analog and digital MEMS microphones into a system design. Link here (PDF) Microphones are transducers that convert acoustic pressure waves to electrical signals. Sensors have become more integrated with other components in the audio signal chain, and MEMS technology is enabling microphones to be […]
App note: NTC thermistors
Application examples of Negative Temperature Coefficient (NTC) Themistors, app note from TDK. Link here (PDF)
App note: How to use power inductors
A great guide from TDK about power inductors used in DC-DC converters. Link here As electronic devices become more advanced, the power supply voltage of LSIs used in them is lowered, so their power consumption can be reduced and their speed increased. However, a decrease in the power supply voltage also causes the requirements regarding […]
App note: CeraLink® Capacitors
Compact and high capacitance ceramic capacitors from TDK electronics. Link here (PDF) CeraLink is a family of very compact capacitors for stabilizing voltages in the DC link. They are therefore suitable for use as either snubber or DC link capacitors. These products are based on PLZT ceramics and are designed to provide engineers with compact […]
App note: Microphone specifications explained
All about MEMS microphone from TDK Invensense. Link here (PDF) A MEMS microphone IC is unique among InvenSense, Inc., products in that its input is an acoustic pressure wave. For this reason, some specifications included in the data sheets for these parts may not be familiar, or familiar specifications may be applied in unfamiliar ways. […]
App note: Model of chip cap tombstoning
Here’s a graphical app note from TDK on the phenomenological “tombstone” when doing reflow soldering. If temperature and solder quantity is inappropriate during substrate mounting, products may not be mounted properly, which causes tombstone
