Technical note from Texas Instruments on their high power density eFuse used in hot swappable servers. Link here (PDF)
As demand for data increases, so does demand for servers and data centers, and thus higher demand for power. Industry trends suggest that power per rack, which was 4 kW in 2020, will be as high as 20 kW in 2025.
Given limited physical real estate available for data centers and servers, the delivery of more power in less area is known as a high power density requirement in server power architectures. Increasing the efficiency of server power supplies can also keep cooling costs down.
Servers are usually scalable and are hot-swappable in order to meet different processing requirements and maintain high system availability. To achieve seamless hot-swap functionality, server motherboards and power distribution boards employ hot-swap controllers or eFuses. Components such as eFuses in server power supplies need to provide higher current to meet increased server power requirements. Protection devices such as hot swaps and eFuses also need to handle high peak current to match the higher peak-processing capabilities of modern microprocessors in servers.