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Hand soldering a WLCSP package

Posted on Wednesday, July 18th, 2018 in how-to by DP

MSOP-10 soldering video at mitxela.com:

I admit that when I made the video of me soldering an MSOP-10 package, I did it because I needed to use the chip right away, and didn’t have time to order a breakout board. But this time, I am just doing this for fun.
MSOP is smaller than TSSOP which is smaller than SOIC which is smaller than DIP. Although the pin pitch is larger, the physical size of the ATtiny9 in the charliestar project is smaller than the MSOP-10 package. Most ATtiny parts are also available in QFN format, which has a smaller rectangle with pads around the edges. But there’s a fundamental limit to how close you can put adjacent pins and still have them reflow correctly.

More details at mitxela.com.

This entry was posted on Wednesday, July 18th, 2018 at 11:37 pm and is filed under how-to. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

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Recent Comments

  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please
  • Marko: armature -> amateur
  • Crawford: Dibs,