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How not to build a semiconductor lapping machine

Posted on Tuesday, May 15th, 2018 in how-to by DP

electronupdate writes:

One area of silicon reverse engineering which has interested me is the delayering of a chip to see each layer which allows superior visibility into the circuitry. I know of two ways: chemical etch and mechanical means.
In this video I try to make a mechanical grinder which can take micron levels of material away: a partial success. Parts are ground but I was not able to keep the silicon absolutely flat. More study of the commercial units is warranted!

See the full post on electronupdate blog.

This entry was posted on Tuesday, May 15th, 2018 at 11:31 pm and is filed under how-to. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

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Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please