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How not to build a semiconductor lapping machine

Posted on Tuesday, May 15th, 2018 in how-to by DP

electronupdate writes:

One area of silicon reverse engineering which has interested me is the delayering of a chip to see each layer which allows superior visibility into the circuitry. I know of two ways: chemical etch and mechanical means.
In this video I try to make a mechanical grinder which can take micron levels of material away: a partial success. Parts are ground but I was not able to keep the silicon absolutely flat. More study of the commercial units is warranted!

See the full post on electronupdate blog.

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