Soldering TQFN with a distance

Posted on Thursday, August 4th, 2016 in techniques by DP


Mare writes:

Here is my solution to this problem. First clamp the Ic to vise or ask your wife to hold the tweezers with the chip
Next, use your sharpest soldering tip and apply some solder to the pads. Please keep in mind the chip has 0,5mm raster between pads.
After soldering all 10 pads it should look something like this
Now place the chip on the PCB and position it correctly – check the orientation. The height of the solder applied to the chip pad will keep the thermal pad away from the traces under the chip. Place soldering tip close to the chip at one pad and heat it up until solder flows from chip to the PCB pad. Don’t push the chip down! Check the position of the chip and repeat this for all pads at one side and then repeat for the rest of the pads

Full details at Mare & Gal Electronics homepage.

This entry was posted on Thursday, August 4th, 2016 at 2:10 pm and is filed under techniques. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

3 Responses to “Soldering TQFN with a distance”

  1. Sjaak says:

    No need to use a supersmall iron. you can use dragsoldering technique using a big blob of solder along the egdes with lots of flux. the pads needs to expand to the sides, but this is mostly the case.

    BTW it is a DFN as it has two rows of pins instead of 4 ;)

  2. xl0 says:

    Just put a piece of Kapton tape below the chip.

  3. stoo says:

    This is not a good idea, the thermal pad is very close to the underlying copper it must not contact.

    I suggest to put a small strip of kapton tape over the thermal pad, so to guarantee the isolation.

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