Contactless transit card teardown


A RFID transit pass teardown from Electronupdate:

Here is the die photo: super tiny. I bet they get thousands of dice off of each wafer. Looks like it’s a protocol called MIFARE. Vendor of the chips is NXP. I think it’s their ultra light family
The amazing bit is that a card is printed with conductive ink, a semiconductor added (with a transistor count in the tens of thousands), a vendor-specific ID placed on the outside with another layer of paper, spooled in to giant rolls, vended for a single trip and then thrown away…..

More details at Electronupdate blog.

Check out the video after the break. 

Leave a comment

Your email address will not be published. Required fields are marked *

Notify me of followup comments via e-mail. You can also subscribe without commenting.