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  1. 0.35mm BGA spacing. Laser drilled blind vias. 4-layer board. For the sake of shaving a few square mm off the component size, that’s a significant increase in PCB manufacture costs.
    I wonder: if there was a [physically] larger chip available, and room for it on the the PCB, how much cheaper would the manufacturing process be?

    1. Nah, you’re supposed to be happy that even the insides are premium :-)
      The BGA sounds like it’s close to one of those wafer-package types, so a trade-off, or no, more likely the chip customer dictated it to be just so. Also for high-freq, things like SOIC and QFP is not even in the picture any more.
      Look at today’s phone PCBs, it’s so tightly packed you can’t even see much routing lines any more, it’s a volume product too. A short step to asking the same guys to do your spiffy smart cable.
      Perhaps the cables are also deliberately un-chunky so that ladies will not have second thoughts putting one in their handbags.

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