Today we previewed the Hacker Camp Shenzhen advanced soldering class to prepare translations and figure out how everything will work. Its way, way better than we had hoped.
In three hours we learned how to remove, reball, and replace a BGA chip. A couple of us did two. No special BGA reballing tools were involved, nothing but cheap hot air stations and $5 “fire starter” soldering irons.
We made a complete how-to pictorial, but we don’t want to spoil anything. The how-to and session videos will go up after the Hacker Camp. This is mind blowing stuff: simple, cheap, almost no tools needed. Really innovative stuff from the cell phone repair markets in Shenzhen, China.
Via Hacker Camp Shenzhen mini-site: BGA chips: remove, reball, replace the easy way