Categories

Reflow oven USB jack test with new heat profile

Posted on Friday, February 1st, 2013 in tools by Ian

image

Cranked the solder temperature down to 210 and tried some boards with bigger parts. Still looking good, though the paste dispenser will help a lot as the tweezers aren’t the right tool. The lower solder temperature still scorches the boards making the tidy white silk a sort of blond roux color. That is a lingering concern and something we need to work out.

This entry was posted on Friday, February 1st, 2013 at 7:57 am and is filed under tools. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

4 Responses to “Reflow oven USB jack test with new heat profile”

  1. rocketscream says:

    Have you try with a better quality PCB (like >TG150)? Silkscreen turning yellow/brownish could also due to the imperfect drying (baking?) process during the PCB manufacturing.

  2. Tim says:

    Where do I get that break out board shown here?

  3. arhi says:

    you might wanna show the profile here :)

    how long do you keep the board in the max temp?

    does this oven have a TC probe you can move around (and position on your pcb) or it only has some TC inside in fixed position? Is there a fan in the oven (can you hear it mixing air while baking) or is only static?

Leave a Reply

Notify me of followup comments via e-mail. You can also subscribe without commenting.

Recent Comments