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Reflow oven USB jack test with new heat profile

Posted on Friday, February 1st, 2013 in tools by Ian

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Cranked the solder temperature down to 210 and tried some boards with bigger parts. Still looking good, though the paste dispenser will help a lot as the tweezers aren’t the right tool. The lower solder temperature still scorches the boards making the tidy white silk a sort of blond roux color. That is a lingering concern and something we need to work out.

This entry was posted on Friday, February 1st, 2013 at 7:57 am and is filed under tools. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

4 Responses to “Reflow oven USB jack test with new heat profile”

  1. rocketscream says:

    Have you try with a better quality PCB (like >TG150)? Silkscreen turning yellow/brownish could also due to the imperfect drying (baking?) process during the PCB manufacturing.

  2. Tim says:

    Where do I get that break out board shown here?

  3. arhi says:

    you might wanna show the profile here :)

    how long do you keep the board in the max temp?

    does this oven have a TC probe you can move around (and position on your pcb) or it only has some TC inside in fixed position? Is there a fan in the oven (can you hear it mixing air while baking) or is only static?

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