App note from Richtek about thermal resistance calculation using component thermal parameters found on datasheets. Link here (PDF) Thermal issue has been a crucial topic for a long time since high power density and low cost requirements became popular. As a power engineer, the assessment of maximum allowable power dissipation of every component in the […]
Tag Archives: Thermal resistance
App note: Plastic package device thermal resistance
App note from Macronix on managing thermals of memory plastic packages devices. Link here (PDF) Thermal system design needs to account for heat transfer at many levels: device, board, and system level. In this document we focus on device level thermal resistance, the relationship between TJ (Junction Temperature) and TC (Case Temperature), and how heat […]
App note: Understanding thermal resistance in the real world
App note from Diodes Incorporated about thermal resistance and how to manage them in real world scenario. Link here (PDF) There can be significant differences between the thermal characteristics stated on a device datasheet and what actually happens in a realworld application. Semiconductor manufacturers usually provide thermal resistance values for Junction to Case (RθJC) and […]