App note: Plastic package device thermal resistance

App note from Macronix on managing thermals of memory plastic packages devices. Link here (PDF) Thermal system design needs to account for heat transfer at many levels: device, board, and system level. In this document we focus on device level thermal resistance, the relationship between TJ (Junction Temperature) and TC (Case Temperature), and how heat […]

App note: Understanding thermal resistance in the real world

App note from Diodes Incorporated about thermal resistance and how to manage them in real world scenario. Link here (PDF) There can be significant differences between the thermal characteristics stated on a device datasheet and what actually happens in a realworld application. Semiconductor manufacturers usually provide thermal resistance values for Junction to Case (RθJC) and […]