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App note: Adding flexibility by using multiple footprints for I2C™ serial EEPROMs

Posted on Sunday, January 21st, 2018 in app notes by DP

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Save PCB space by utilizing EEPROM SOIC-8 area, here’s an application note from Microchip. Link here (PDF)

For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more commonplace. This offers a number of benefits; the reductions in footprint size and component height are some of the more obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.

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