Hacker Camp Shenzhen Video: Advanced soldering demo at Hacker Camp Shenzhen

By ian

QFN, BGA, plastic connectors, other crazy advanced removal and replacement of surface mount components by a teacher at a Lande Mobile Repair School in Shenzhen China. Part of Hacker Camp Shenzhen 2014. Presentations, pictures, and overview here.

Next week we’ll have step by step instructions for reballing BGA chips. Get your BGA reballng practice kit from Seeed and follow along.

Via Hacker Camp Shenzhen mini-site: Hacker Camp Shenzhen Video: Advanced soldering demo at Hacker Camp Shenzhen

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5 Comments

    1. I’m working on uploading a better version, but I had to run this to Hong Kong by sneaker net and upload by cell phone so a 8gb 1080p upload was impossible.

  1. Great stuff. Thanks for posting.

    It’d be neat to have some sort of dummy BGA chip for practice that just passed the pins through to the top of the package so that you could do continuity tests instead of having to test a real chip’s functionality. I could see that speeding up the process of acquiring this skill.

    1. You can get dummy chips like that for testing but they work by connecting pairs of pins/pads/balls together. You’re supposed to prepare a special PCB that daisy chains all those pairs together.

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