By ian

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Hacker Camp Shenzhen’s main event is a two day soldering course at a mobile phone repair school in Huaqiangbei. They teach a technique to replace the solder balls used to connect modern BGA chips to circuits boards. Usually this process requires special machinery, but the repair school teaches a simple hand technique that we learned on recycled cell phones. We also learned advanced soldering tricks and techniques from a master. See the first day of soldering workshop below the break.

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Nik is removing an RF shield in order to get at the BGA chips hiding underneath.

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RF shields, memory chip, CPU all removed from the board.

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After taking the CPU off the board, we clamp it with the PCB holder for cleaning.

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Removing and cleaning BGA chips.

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When the chip is clean and shiny, it’s ready to be reballed. Mastro puts a stencil over the chip, finds the matching lines, and holds the stencil with tweezers. After that, Mastro places dry solder paste onto the stencil.

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Tom holds the stencil with tweezers while heating the solder paste quickly with the hot air rework station. The balls start forming in the stencil.

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Aaron @ Oomlout was the first to successfully reball his BGA chip. He’s awarded the iPhone5c knock-off we bought in the market the day before. Later the instructor tore down the phone and we found several surprises inside.

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Aaron’s brand new phone and reballed chip.

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Bunnie shows off his reballed BGA chip.

Via Hacker Camp Shenzhen mini-site: Hacker Camp Shenzhen Day 2: Soldering workshop

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