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TI MCU BoosterPack Design Challenge

Posted on Monday, January 21st, 2013 in contest, MSP430, News by the machinegeek

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If you’ve ever thought of designing your own BoosterPack for the TI Launchpad, here’s your chance to build your own BoosterPack (BYOB). TI is conducting a TI BoosterPack Design Challenge for hobbyists and makers in the continental US. Prizes include a trip to Design West 2013. Judging criteria include originality and creativity, quality and marketability. Contest entries are being accepted by TI until March 1, 2013.

You can view the official contest rules and prize list at TI.com.

This entry was posted on Monday, January 21st, 2013 at 6:00 pm and is filed under contest, MSP430, News. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

One Response to “TI MCU BoosterPack Design Challenge”

  1. Jiri says:

    Grrr, only for U.S. residents. :’-(

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Recent Comments

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