Categories

Using tape as a solder paste stencil

Posted on Monday, July 9th, 2012 in DIY by DP

Sjaak shared his experiment using two L-shaped pieces of tape as a solder paste stencil. After he applied the solder paste he separated some of it using a knife.

as expected to much paste was applied as the opening was the size of the chip. I expect better result if the opening was the same size as the exposed pad or little less (also depends on the chipsize)

Via the forum.

This entry was posted on Monday, July 9th, 2012 at 11:00 am and is filed under DIY. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

Leave a Reply

Notify me of followup comments via e-mail. You can also subscribe without commenting.

Recent Comments

  • Daniel: Do I comment here or on FB?
  • Craig B: Shouldn't the default be 00xxx010? Note that bit 0 appears out of order in the documentation. In that case I think the initial value is...
  • JJM: From the datasheet extract you are showing, the power up status should be 00xxx010, not 000xxx01. Bit numbering is misleading since 'measurement resolution' is apparently...
  • Jan Ciger (@janoc200): Hmm, that could actually explain why the three sensor IMU breakout I have bought a few years ago had all sorts of issues - I...
  • Travis: Is it preset to the windows 3 fingered salute?