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Using tape as a solder paste stencil

Posted on Monday, July 9th, 2012 in DIY by DP

Sjaak shared his experiment using two L-shaped pieces of tape as a solder paste stencil. After he applied the solder paste he separated some of it using a knife.

as expected to much paste was applied as the opening was the size of the chip. I expect better result if the opening was the same size as the exposed pad or little less (also depends on the chipsize)

Via the forum.

This entry was posted on Monday, July 9th, 2012 at 11:00 am and is filed under DIY. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

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