Microchip describes how to make CAD footprints that fit several different sizes of serial EEPROM data storage chips. This gives your project flexibility in case the larger footprints can no longer be sourced:
For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more and more commonplace. This offers a number of benefies; the reductions in footprint size and component height are some of the obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.