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App note: One serial EEPROM footprint to rule them all

Posted on Saturday, June 23rd, 2012 in app notes by DP

Microchip describes how to make CAD footprints that fit several different sizes of serial EEPROM data storage chips. This gives your project flexibility in case the larger footprints can no longer be sourced:

For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more and more commonplace. This offers a number of benefies; the reductions in footprint size and component height are some of the obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.

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2 Responses to “App note: One serial EEPROM footprint to rule them all”

  1. Gridstop says:

    What’s with the rounded pads for the soic/tssop/msop parts? Has anyone seen rounded smd pads before like that? Useful/useless for hand soldering?

    • Elias says:

      I don’t think the rounded pads make too much difference in hand soldering, or they might actually improve it with the surface tension holding the blob better in the rounded pad.

      The way to go of course is hot air and solder paste, available very cheaply nowadays.

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