sqkybeaver wrote:for the coin cell i suggest changing the center pad to a circle the size of the cell, the solder mask around the pad can prevent contact with the pad.
Done. I usually put a small blob of solder in the pad to raise it up a bit, but here there's no other tracks passing under the battery holder so the increased pad size -method works fine here.
Bertho wrote:Does the PCB manufacturer accept inner angles this sharp or do you need to make remarks on the outline to get it made right?
I've no idea... I hope that they will mill as close as possible to the outline in accordance to their bit size, and that they leave "unreachable" board rather than taking away extra to reach the edge. I'm sure they will complain if it will destroy the pcb. I fear that asking them (Seeedstudio) how it should be done and what they can handle would just result in some random incomprehensible google-translated reply. So I'll just try and see what happens. :-)
AndThen wrote:If not I propose one small change. To the led drive traces nudge them apart and add "solder jumper" to each. So the arms can be sawn off and extended with wires.
That's a fun idea. Why not.... Were would the best cutoff point be you think?