bearmos wrote:If you don't follow the instructions on the package (only applicable if you're assembling via reflow) then you risk blowing the package of the device. Plastic cased IC's absorb the humidity from the air, when the entire package is heated, the moisture can boil and cause damage to the IC package (known as the popcorn effect). This is less of an issue if you're hand assembling with a soldering iron since you're not heating the entire package, but mainly the leads.
this is often why you may see a warning about baking them if moisture is above 10-20% per the blue dots






