I received the PCBs for version 0.2 yesterday, and soldered the first one up. I'm really pleased with it:
The TQFP part proved a _lot_ easier to reflow. It came off the skillet with a few minor solder bridges, almost all of which were easily solved with a fine tipped iron and some flux. Other than that, there were a couple of minor issues where I'd gotten a little too enthusiastic about packing components in close and they'd reflowed into each other, something I can fix in a subsequent revision. The greenwire you can see in that photo is because of an 'improvement' in how I hooked up the programming header's power bus that turned out to be anything but.
All in all I'm delighted with how it's come out, and I think this is the run I'll send out to interested alpha testers.
I also experimented with a new approach for doing solderpaste stencilling without panelizing, adding snap off 'wings' to the board:
Unfortunately, the stencil came back from the factory with holes that are marginally too small, but I think it would have worked well if not for that.