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Tools of the trade / T962A IRreflow oven setting for Sn42Bi58 Solder paste
that A.M is using Similar process for Reflow soldering i.e (IR reflow oven + Sn42Bi58 solder Paste) . Now let me explain you in detail about the issue we are trying to fix.
Our IR oven is T-962A similar to QS-5180C from Qinsi Technology . we are using Sn42Bi58 solder paste from Synaptic Tin tin lead-free solder paste (Sn42Bi58 3.0 P/N# UP301B) (Purchase from manufacturer via Taobao http://item.taobao.com/item.htm?spm=a1z ... 517179090# ) Sn42Bi58 3.0 is little bit more smooth/finer than Sn42Bi58 2.5.
Now the problem is, I have never used this Sn42Bi58 paste before, usually I use SAC>SnAgcu paste. So I bought it in January , but stored it in refrigerator as I used previous stock left some SAC paste. Two days ago I open that 500mg pack to test , and surprisingly even after 6 month solder paste is in very good condition/flux constant is also good, because we store it 0-5 C temp. So in order to test this paste I required to set the temperature profile of my Oven. So I set the reflow profile by referring some documents/datasheet for SnBi paste available on internet. After running couple of test reflow process on a sample PCB, I noticed that the paste does not melt even at 160-170 reflow range. when i took out PCb and test the paste, I found that Flux is doing its work at expected temperature but metal part is not. I had used 6-7 different temperature setting for calibration referring the attached datasheets.
So can any member help me to figure out what am I doing wrong with the process.
If you need more details on temperature profile I have used on it. let me know, I will share it. Reflow temperature profile that I used as reference are linked below.
From Qualitek Bi58 http://www.qualitek.com/bi58_888Dtds.pdf
From AIM solder http://www.aimsolder.com/sites/default/ ... _rev_1.pdf
Temperature from from Solder paste manufacturer from China.
-Chinmay