Thanks wiki page for all the links. But there are two issues. "T1, T2 NPN, 200mA+, 30+hfe transistor (SOT23-BEC) " Is obsoleted "T4 PNP, 1A+, 40+ hef transistor (SOT23-BEC)" didn't have a link =(
The replacements are the top two items in the mouser cart. If someone would give them a once over for me please....?
The first one is the PNP it was selected from the master parts list. The second is the NPN, it was selected by checking "most" of the traits on the obsoleted ones page and then grabbing the "gen-pur" part.
These are already out of date, full of errors, steals candy from children, kicks your dog ect...
Now with that disclaimer out of the way, I'm going to attach two patches for "insurance" purposes.
The first: Is the "least intrusive" version, there are two known issues in this patch 1: There shouldn't be ANY changes in pic.c. You can replace/revert it from the svn repo 2: The related changes in main.c to MEM_Init calls This patch includes: Parallax BS2 Firmware with support for pic18(416 mode), pic24 (424 mode), and four-wire pic32 -L(ist) option from the USBASP patches The few "fixes" for serial port, and maybe some random I don't remember. [attachment=2]
The second: Is my complete development branch in all it's glorious randomness... This includes a 4 wire pic32.c, along with I don't recall what else. So I attach the Changelog from cvs commits. [attachment=1] [attachment=0]
I don't have a schematic drawn up sorry MCLR is pulled low via an NPN VPP is switched via NPN-PNP from the wall wart 5v to 3v3 Conversion is thru a TXB0104
I ran out of breadboard space. So I made more! [attachment=2] (What are the toys you ask?) RX62n, Robert, Dp Sticker, Sweet stamps, 1/6th scale cozyiV jig, and behind that an i forget what scale f16 blueprint. Oh and a PC case there in the front protecting the plastic on the cheap drafting table. [attachment=1] After the third missed punch I fliped it over and did away with the fine tip pin and went directly to a safety pin =) [attachment=3] It's cardboard coated in white glue(Elmers indeed!) [attachment=0]
Overview: Laying out the circuit board is one of the last steps in the design process and quite often doesn't get the attention it deserves, and high speed applications can significantly affect circuit performance if not done correctly. This webcast will cover the ins and outs of PCB design and layout, in a practical and straight forward approach. The presentation is packed with useful information accumulated with tips, tricks and techniques that can easily be implemented into your next design to help improve overall circuit and system performance.
Who should attend? This webcast is a "must see" for students and those new to PCB design, especially for those concerned with high-speed circuitry. It will also be a good refresher to those experienced in layout.
Presenter: John Ardizzoni, High Speed Amplifiers Product Manager, ADI John Ardizzoni High Speed Amplifiers Product manager started at Analog Devices in 2002, as an Application Engineer in the High Speed Amplifier group. Prior to joining Analog Devices John worked for IBM, in RFIC applications and at M/A-COM for 20 years. John is also co-author of Analog Devices Rarely Asked Questions (RAQ's) column. John has over 30 years experience in the electronics industry, and has authored numerous articles and design ideas.
It is important to note that the preheat and ramp down are multiple-purpose. 1: It decreases the high temp, solder flow time 2: It normalizes thermal expansion, both in the chip and in the chip to board connections.
A appropriate demonstration is maybe cold water on a hot light bulb, common failure for a mechanics drop light.
Figure 1 shows the internal lead, and we all know any picture with that color scheme means really really small =D