Hey guys, we don‘t need to talk about these things, they are meaningless. The quality of components depends on their price, not about where they are made. Whether ''Made in China'' or not, price depends everything, you get what you've paid. There also have a great number of high quality productions in China and they are not cheap indeed. So, we shouldn't blacken China or other places, it‘s depends on yourself and how much you will pay for it
Just stop here please I hope we can just talk about technic rationally and harmonically here.
1. BOM updated - 2 lines less. Some components had minor description/value differences. These appear on single row now 2. Added separate BOMs for front, back, OLED and full PCBs 3. Added separate pick-and-place files for front, back, OLED and full PCBs
If yes, when did you order the PCBs? Because there were some corrections on some element names, which will be different in last version. (namely C68->C88, L3->L4, L3_1 -> L3, OLED1 -> DISPLAY, OLED1_1 -> OLED1).
Yes, it's "pick-and-place" data... I used the last 5.2C version, that would be great if you could upload the data to github Thanks!
Hi sparkybg ; ) Would you mind offering the SMT coordinate? Because JLCPCB‘s SMT is much cheaper than before and there are a great number of coupons in my account... Thanks!
Can I ask a question? Why are you people ordering black, white and other color pcb's without any transparency? It is PAIN IN THE ASS to debug such board if any modifications are needed.
Just because they looks like more beautiful and superior... So,it’s not only a solder but also a work of art. : )
MOSFETs must be at least 80V. This is discussed several times already.
Oh, Thanks...It’s a little awkward...I did‘t review the threads before. I have another question for you. The back board(power) and OLED board will still be 2-layers ? It may bring some problems when you want to order the 3in1 array, because they have both 2-layers and 4-layers so that we can't mix them up, or it means we won't have 3in1 array anymore... Sometimes 3in1 array are much cheaper than separated boards.
I placed 30x30x7mm FPGA heat sink on the back. Here's the result.
The hottest elements now are the recitifier diodes. I will consider SMD diodes in the next revision + another heatsink for them, or heatsink only for them - I am yet to try 0.022ohm transistors and I think they won't go too hot even without heatsink.
They are really pretty hot... How about using other packages? Such as TO-220 or full-bridge rectifier, the heatsink can be assembled the on them.
pcb manufacturers can't do it. They say straight-in type-c mouths, hole spacing they can't do. If you can make it there, you can try modifying the pcb yourself
It‘s just a little proposal for coming UN5.2b. The DIP connector is not necessary, you can use the SMD package if your manufacturer can’t deal with dip.
There is no point, especially this standing type-c, which we have tried, the process does not allow, the hole spacing is too small and the cost is uncontrollable. Who are you in the qq group, don't make any comments, verify them yourself before you give them
I don‘t understand why you need to keep down the cost of it, unless you just want to commercialize it. The vertical Type-C connector is commen used, your point is irrespective of tech. They are pretty cheap(0.1$-1$) and durable and have much types to supply, why not consider about them？ On the contrary, I deem that the biggest problem is that there are too many types to choose, even they can’t be found in other countries and places
