App note: Hand soldering tutorial for fine pitch QFP devices


No SMD tools removal and soldering of QFP packages tutorial from Silicon labs. Link here (PDF)

This document is intended to help designers create their initial prototype systems using Silicon Lab’s TQFP and LQFP devices where surface mount assembly equipment is not readily available. This application note assumes that the reader has at least basic hand soldering skills for through-hole soldering. The example presented will be the removal, cleanup and replacement of a TQFP with 48 leads and 0.5 mm lead pitch.

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  1. Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to 270C.

    The procedure described also applies too much heat, I would solder with lead based solder in order to benefit from a lower melting point and heat the tip to 250-275 C, no more.

    1. Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in the absence of one I’ve also had good results with displacing the original solder with prodigious amounts of special, ultra-low melting point (de-)”solder” they sell just for this purpose – it stays liquid much longer giving the user time to melt everything all around and simply shove the chip away…

  2. Ya, I can recommend the low melting point solder. I used brand ‘ChipQuik’ and it’s amazingly easy to use.

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