Categories

Workshop Update for November 28th, 2012

Posted on Wednesday, November 28th, 2012 in Workshop Update by DP

Ian is in Tokyo visiting the Maker Faire set to be held during the upcoming weekend (1-2 December). Our resident blogger Filip/arakis is back from our Shenzhen sourcing challenge, and is currently fighting jet-lag. Normal posting schedule will resume tomorrow.

We continue to work on our xQFP breakout board updates. Currently we’re various¬† researching QFP standards to get everything right the first time around.

Image via Make.

This entry was posted on Wednesday, November 28th, 2012 at 11:00 pm and is filed under Workshop Update. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

2 Responses to “Workshop Update for November 28th, 2012”

  1. Winston says:

    What’s that guy pulling on?

Leave a Reply to openmakersdaily

Click here to cancel reply.

Notify me of followup comments via e-mail. You can also subscribe without commenting.

Recent Comments

  • Joe Desbonnet: Ya, I can recommend the low melting point solder. I used brand 'ChipQuik' and it's amazingly easy to use.
  • Jerome: I need a new BusPirate for the Fablab ;) Many thanks!
  • Max: Seems like an unexpectedly violent way to remove the chip indeed. A hot air station should of course do the job just fine, but in...
  • jose: Part removal described here is pure butchery, the cheapest hot air station will do a fast and clean job removing the QFP, heat air to...
  • Cody: Yes please