Hacker Camp Shenzhen Day 3: Soldering workshop

in Hacker Camp Shenzhen by DP | 1 comment

By ian

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Hacker Camp Shenzhen’s main event, the BGA reballing course, continues for a second day. At this point most people had reballed a chip, or were close to finishing. For the rest of the day out instructor, a master solder ninja, took on every challenge we tossed at him.

Before the workshop stated though, we wander a little in the classroom and scope out a lot of cool stuff. There are a bunch of tools that diagnose memory and CPU chips, as well as phone screens. Zack holds a CPU and memory tester with two BGA chip clamps custom made for the school.

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The hour and a half of the workshop is about practicing. Everybody reballed chips a few times. The teacher walks around to inspects chips and dish out cool tips.

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Aaron starts reflowing his awarded phone from yesterday. He found an SD card and socket inside the phone.

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We challenged the teacher to remove and replace all kinds of delicate connectors, connectors on flex circuits, and more. He handled it all like a pro. No special techniques needed, just patience and practice.

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Bunnie shows up with iPhone5 boards, chips, and stencils from the market. He challenges the teacher to reball and resolder the chips.

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Fist the he solders the chip to the PCB using the factory supplied balls. Then he removes and cleans it, and applies new balls.

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This is the reballed iPhone5 radio chip. Perfect the first time.

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Who but real geeks surround a BGA chip to take photos and gawk? It’s amazing to see how he does it.

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THAT’S A WRAP! We had so much fun in the soldering workshop that we stayed an extra half an hour to reball more chips.

Via Hacker Camp Shenzhen mini-site: Hacker Camp Shenzhen Day 3: Soldering workshop

This entry was posted in Hacker Camp Shenzhen and tagged , .

Comments

  1. DJPhil says:

    This is really awesome stuff. Will there be video to come?

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