TI samples MSP430F5259 ultra-low power MCU
components, MSP430 and tagged MSP430F5259, sample, Ti, ultra-low power.
TI has announced they’re accepting requests for samples of their MSP430F5259 Ultra-Low Power MCU. It features 1.8V split-rail I/O architecture without need for level shifters, 128Kb flash memory and 32Kb RAM for wireless protocol integration and eight serial interfaces for communication to sensors or peripheral devices. The component is available in 5mm X 5mm BGA and VQFN (RGC) 64 packages. The low power needs make them suited for always-on, battery-powered applications.