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TI samples MSP430F5259 ultra-low power MCU

Posted on Friday, November 1st, 2013 in components, MSP430 by the machinegeek

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TI has announced they’re accepting requests for samples of their MSP430F5259 Ultra-Low Power MCU. It features 1.8V split-rail I/O architecture without need for level shifters, 128Kb flash memory and 32Kb RAM for wireless protocol integration and eight serial interfaces for communication to sensors or peripheral devices. The component is available in 5mm X 5mm BGA and VQFN (RGC) 64 packages. The low power needs make them suited for always-on, battery-powered applications.

The product datasheet and an app note are available.

This entry was posted on Friday, November 1st, 2013 at 12:25 am and is filed under components, MSP430. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.

3 Responses to “TI samples MSP430F5259 ultra-low power MCU”

  1. f4grx says:

    Also worth reading: the errata sheet.

    http://www.ti.com/litv/pdf/slaz532b

    That’s how I learn wether devices are *really* usable in my designs… This is very important with TI chips, they have lots of erratas.

  2. martin says:

    the chip actually has 128 kilo*bytes* of Flash and 32 kilo*bytes* of RAM. This is important distinction since less honest manufactures like to inflate their numbers.

    • Sleepwalker3 says:

      Yes, it’s the old “Headline ratings”. That sort of thing is very common in things like Mosfet specs.
      I like the dual voltage capabilities, but I wish they would make it so the I/O supply can go to 5V, not just 5V tolerant, Some of us still need to use 5V and though technically over the threshold, 5V tolerant doesn’t always work that well in practise.

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