Diamond package from NXP, the world’s smallest logic package
Drone refers us to this short video from NXP on very small pitch parts (0.35mm) and the challenges in mounting them. NXP debuts their new Diamond package which they report is over 25 percent smaller than their XSON package (suffix GN), previously the world’s smallest package. The video point out that this design retains the traditional 0.5mm pad pitch which allows simplified PCB assembly.
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