Diamond package from NXP, the world’s smallest logic package


Drone refers us to this short video from NXP on very small pitch parts (0.35mm) and the challenges in mounting them. NXP debuts their new Diamond package which they report is over 25 percent smaller than their XSON package (suffix GN), previously the world’s smallest package. The video point out that this design retains the traditional 0.5mm pad pitch which allows simplified PCB assembly.

Via the contact form.

This entry was posted in components, News, Videos and tagged , , .

Comments

  1. solipso says:

    As as electronic design engineer, I am curious when Marketing Departments of all those big parts producers realise that future selling point is not miniaturisation, but integration.
    Wish NXP to not to sell a single of such a tiny and therefore crappy (because technologically hardly manageable) bit of shit!

    • langwadt says:

      why so angry?
      with integration occasional comes the need for a gate or two to glue things together, and the size isn’t a problem, lots of passive in similar or smaller packages used already

      • solipso says:

        That’s the point: glue logic. Why the hell in the age of 10nm 3D structures and 2k+ pin BGA packages we are forced to use discrete logic gates to invert reset or debounce a switch? I will not touch a micro without at least some configurable logic blocks even with a nine feet stick anymore! ANY design using glue logic (maybe apart from level shifters etc. when inevitable) should be considered obsolete by now. I understand that somebody may feel it different and likes to troubleshoot circuits that looks like a poppy pretzel, but my life is too short for such a patience exercises. Btw. The first MCU manufacturer that will incoporate FET gate drivers into his silicon will make a fortune on this.

      • langwadt says:

        In the real world you don’t always have choice, it is either fix the problem with glue or drop the project. most PCBs look like a “poppy pretzel” with bypass caps anyway, a gate or two won’t make a difference for production, configurable logic takes troubles shooting too.
        Adding fet drivers to an MCU might be convenient but won’t make a fortune, high voltage for drivers and small features for MCU and memory are two different processes, there is a reason why all the fast stuff only has 3V IO, if not less

    • AMS says:

      As someone who mostly works on power electronics stuff, I’m glad they’re still doing discrete logic. You may like highly integrated controllers, but I need to be able to put a hardware protection / interlock circuit on a board that works even if the FPGA, CPLD, and MCU on the board all go insane. When bad software can lead to half your board plating itself across the celing, there’s advantages to doing your programming in solder and copper.

Leave a Comment

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

Notify me of followup comments via e-mail. You can also subscribe without commenting.