TI MCU BoosterPack Design Challenge
If you’ve ever thought of designing your own BoosterPack for the TI Launchpad, here’s your chance to build your own BoosterPack (BYOB). TI is conducting a TI BoosterPack Design Challenge for hobbyists and makers in the continental US. Prizes include a trip to Design West 2013. Judging criteria include originality and creativity, quality and marketability. Contest entries are being accepted by TI until March 1, 2013.
You can view the official contest rules and prize list at TI.com.
This entry was posted in contest, MSP430, News and tagged boosterpack, TI Launchpad.
Comments
Grrr, only for U.S. residents. :’-(