Workshop Update for November 30th, 2012

in Workshop Update by DP | 5 comments

We’ve finalized our xQFP footprints. The pads in the old design were short, making soldering hard. The new design remedies that, and comes with our standard CC BY-SA license. The files are available in our Eagle library.

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Comments

  1. Adrian says:

    How about combining the two footprints on opposite sides of the same PCB? Similar concept like this SOIC/TSSOP breakout board: http://store.oshpark.com/products/28-pin-soic-tssop-to-dip

  2. having unconnected lines in the middle of signal traces will probably have bad effects with high-speed signals.

    they will act as quarter wave opened line stubs, e.g. resonant bandpass filters.

    maybe that’s acceptable for a breakout board, because the signal frequency will never be so high… but whatever.

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