Fine pitch BGA deadbug soldering
Xevel shows us how to solder fine pitch BGA dead-bug:
After seeing a few posts about “deadbugging” (soldering wires to the leads or pads of a component instead of soldering it on its recommended footprint) of BGA chips on Dangerous Prototypes, some with “big” solder balls, and some with smaller ones, I thought I would share my latest attempt at it.
Via the comments.
Check out the video after the break.
This entry was posted in DIY and tagged soldering.
Comments
Impressive work, I would not have thought to try it that way. Re: “…remote temperature was jumping all over. ” I have the USB eval board for that chip, the TI TMP006. As I recall, this chip is equally sensitive to IR radiation from both the front side and the back side. That why you need to mount it backed against a solid IR-opaque surface with the same temperature as the chip itself, to get useful IR temperature readings. I think there is an app note that goes into some detail about the board layout requirements.
This is new? Just a minor variant on dead-bug. I’ve done this kind of thing many times. Another option where lead-length matters (parasitics!) is to solder small wire tails on the BGA pads then solder the ends of the tails directly to the host device pins (and/or a small breakout). This I call Octupus Wiring. The name should trigger an image… Simple. But it takes keen vision (magnification) and a very steady hand.